About Us

Hainan Huanyu Technology Co., Ltd. is situated in the Longhua District of Haikou City, Hainan Province. Spanning a total area of approximately 200,000 square meters, it serves as a large-scale production base for advanced-process chips within China. With a total project investment exceeding ten million RMB, the facility possesses robust manufacturing capabilities and primarily produces high-end logic chips and power chips utilized in fields such as consumer electronics, automotive electronics, industrial control, and artificial intelligence. Leveraging the R&D strengths of its headquarters, the factory has established a comprehensive chip production supply chain-spanning from design verification to mass manufacturing-enabling it to provide end-to-end chip manufacturing services to domestic and international clients.

Regarding the factory layout and production workflow, the facility is organized into six core production zones based on the stringent classification requirements for chip manufacturing: wafer preparation, lithography and etching, ion implantation, thin-film deposition, chemical-mechanical polishing (CMP), and testing and packaging. Notably, the cleanroom environment within the core production workshops meets Class 1 standards, thereby satisfying the exacting environmental prerequisites for chip fabrication. The production lines are equipped with internationally advanced manufacturing machinery-including lithography, etching, and deposition systems-and are integrated with a comprehensive digital production management and control system. This system enables full-process data traceability-from the initial wafer input to the final product dispatch-allowing for the real-time monitoring and precise adjustment of production parameters for every single chip, thereby ensuring that product yield remains consistently at an industry-leading level.

Currently, the factory is capable of mass-producing chips utilizing processes ranging from 14nm to 28nm, while also possessing pilot production capabilities for 7nm process chips. To address the specific requirements for high reliability and stability demanded by automotive and industrial chips, the factory has established a dedicated quality control system. This system meets all testing requirements for automotive-grade chips under the AEC-Q100 standard, and the facility has successfully become a core chip supplier for numerous mainstream automotive manufacturers within China.

In terms of quality assurance, the factory has implemented a comprehensive quality management system that spans the entire supply chain-from incoming raw materials and the production process itself to the final product dispatch. All raw material suppliers have obtained international qualification certifications for the integrated circuit industry. Every batch of incoming wafers and chemical reagents undergoes multiple rounds of rigorous inspection, and specific quality inspection checkpoints are established at every stage of the production process. Finished chips must successfully pass multiple rounds of testing-including electrical performance, reliability, and environmental adaptability tests-before being cleared for dispatch. Consequently, the product pass rate consistently remains above 99.9%, and the facility has successfully obtained both the ISO 9001 Quality Management System certification and the IATF 16949 Automotive Quality Management System certification. Regarding green manufacturing, the factory strictly adheres to national environmental protection standards for the integrated circuit industry. It has established a closed-loop system for treating wastewater and exhaust gases; industrial wastewater generated during production undergoes multi-stage treatment, allowing over 70% to be recycled. Furthermore, after purification, exhaust gas emissions meet standards that are significantly more stringent than national regulatory limits. Consequently, the factory has been successively recognized as a National-Level Green Factory and a Demonstration Unit for Clean Production within the integrated circuit industry.

In terms of development strategy, the factory will continue to substantially increase its investment in the R&D of advanced process technologies. It aims to drive the mass production implementation of advanced packaging technologies and further expand its overall manufacturing scale. A key focus will be on enhancing production capabilities for automotive-grade chips, AI computing chips, and power semiconductors. By doing so, the factory seeks to support the autonomous development of the domestic integrated circuit industry and assist its upstream and downstream clients in creating highly competitive chip products.